Pre-loaded force sensors

ABSTRACT

Pre-loaded force sensitive input devices, force sensing resistors (FSR), are formed as a multiple membrane assembly that is capable of detecting low intensity pressure inputs and quantifying varying applications of pressure to the sensor surface. Pre-loading the force sensor elements results in controlled amount of force between the two substrates causing a constant state of pre-load and eliminating the low-end or minimal pressure signal noise associated with unloaded sensors. Pre-loading the force sensing resistor sensors also enables the sensor to detect removal of low intensity pressure input such as might occur during theft of light weight articles placed in contact with the pre-loaded force sensor. Using an FSR or FSR Matrix Array will enable any handling of protected retail packaging to be detected and identified. A library of “touches” can be established that will yield cutting, ripping, twisting, etc. making the detection of a theft in progress more accurate.

RELATED APPLICATIONS

This application claims priority from U.S. Provisional PatentApplication 61/794,361 filed Mar. 15, 2013. This application is also acontinuation-in-part of copending U.S. patent application Ser. No.13/632,571 filed Oct. 1, 2012 which claims priority to U.S. ProvisionalPatent Application 61/565,847 filed Dec. 1, 2011 and U.S. ProvisionalPatent Application 61/541,608 filed Sep. 30, 2011.

FIELD OF THE INVENTIONS

The present invention relates generally to the field of analog inputsensors and more specifically to the field of pre-loaded force sensingresistor input sensors electronic devices.

BACKGROUND OF THE INVENTIONS

Modern interface controls are integrating electronic touch sensors todetect inputs. Conventional sensor surfaces based on force sensingresistors generally suffer from relative insensitivity to theapplication of very light input force or the removal of very light inputforce due to the materials used and the density of material necessary toachieve a functional sensor. Different sensors are currently beingemployed to prevent retail theft and many of the sensor configurationsprovide ambiguous signals or are too slow to be effective in theftprevention.

SUMMARY

The method and apparatus for pre-loaded force sensitive input devices,force sensing resistors (FSR), as disclosed below are formed as amultiple membrane assembly that is capable of detecting low intensitypressure inputs and quantifying varying applications of pressure to thesensor surface. Pre-loading the force sensor elements results incontrolled amount of force between the two substrates causing a constantstate of pre-load and eliminating the low-end or minimal pressure signalnoise associated with unloaded sensors. Pre-loading the force sensingresistor sensors also enables the sensor to detect removal of lowintensity pressure input such as might occur during theft of lightweight articles placed in contact with the pre-loaded force sensor.Using an FSR or FSR Matrix Array will enable any handling of protectedretail packaging to be detected and identified. A library of “touches”can be established that will yield cutting, ripping, twisting, etc.making the detection of a theft in progress more accurate.

A Force Sensing Resistor Smart-Peg may be used to support and displaymerchandise and identify theft when it is in progress. A FSR Smart-Pegcombines a force sensing resistor element printed on cardboardmerchandise packaging that may or may not be coated with plastic. Thecardboard is stamped to form a curved leaf-spring which is oriented tomaintain pre-loaded contact with electrodes of the Smart-Peg as themerchandise is displayed hanging from the Smart-Peg. This pre-loadedstate will allow extra time for photographing any person lifting ormoving the packaging to assist in identifying thefts in progress becauseas the product is lifted the sensor will remain in contact with theelectrodes.

Force sensing resistor pre-load options include a fixed weight,adhesive, vacuum or differentially embossed upper and lower substratescausing a pre-load between the substrates. Another alternative forpre-loading FSR sensors is the use of a magnet or magnets on one or bothsubstrates to control the intensity of the pre-load force. When used togenerate a pre-load a magnetic field will allow a wide range of options.

A hybrid capacitive force sensing membrane assembly is formed withconductive particles by using two sheets of Mylar (PET) or other clearor any opaque substrate coated with oriented patches of conductiveparticles on apposing surface of the parallel substrates along with anarray of parallel conductors on each substrate. As a capacitive sensor,the electrical charge of a user's hand, finger or other extremity issensed by the conductive layers of the sensor as a function of the inputextremity's location and proximity to the sensor surface. As a forcesensor, a user's input contact with the sensor surface is detectablewhen conductive elements on apposing substrates are forced into contactwhen the input force is applied. Increasing the applied force increasesthe area of contact between the substrates increasing conductance andincreasing the number of conductive particles in the force sensingresistor elements making contact allowing the electrons to travel fromone conductive trace on a first substrate through the contacting FSRelement, such as CNT patches, to a perpendicular conductive trace on asecond substrate.

The conductive traces and patches discussed below will generally referto PEDOT or other highly conductive material, generally on the order ofless than 50 ohms, as the deposited material. Any suitable conductivematerial may be used in place or PEDOT in this disclosure such as carbonallotropes such as carbon nanotubes (CNT) and graphene or conductivepolymers such as Poly(3,4-ethylenedioxythiophene) or PEDOT (or sometimesPEDT) or metal oxides such as zinc oxide or indium tin oxide (ITO),indium zinc oxide (IZO), aluminum zinc oxide (AZO) or gallium zinc oxide(GZO).

Combining capacitive and force sensing resistor sensors provides ahybrid sensor with a z-axis depth of field sensitivity permittinggesture sensing with capacitance reacting to the approaching fingeractivator, then the FSR responds to applied force of the finger andcapacitive sensing again responds as the activating finger is withdrawnfrom the sensor surface.

The method and apparatus for force sensitive input devices disclosedbelow are formed as a membrane that is capable of detecting pressureinputs and varying applications of pressure. A transparent or opaqueforce sensing membrane is formed with carbon nanotubes, conductivepolymers, graphene or other conductive or semi-conductive material byusing two sheet of Mylar (PET) or other clear or opaque substrate coatedwith oriented patches of conductive polymer, micro-particle deposits orcarbon nanotubes (CNT).

The coating process includes conductive particles or micro-particlessuch as zinc oxide, carbon or other suitable materials or carbonnanotubes mixed in an aqueous or other solution and deposited using anysuitable technique such as aerosol jet deposition, or suitable printingsuch as screen, flexo, gravure, offset, litho or other suitable method.The aqueous solution may be an alcohol carrier or other suitable liquidand may also include one or more additives such as a suitable ionomer tobind the CNT to prevent the CNT from passing through human skin or lungmembranes. The clarity or light transmission of a transparent forcesensing membrane is rated at about 92%, which to the human eye seemslike looking through clear glass. Higher resistance of the conductiveparticle patches improves the light transmission through the sensor.Alternatively, conductive polymer patches such as PEDOT or othersuitably conductive polymer may be used to form force sensing resistor(FSR) patches.

A transparent force sensing membrane is made by depositing conductiveparticles, such as CNT or other suitable semi-conductive particles, inFSR elements such as oriented patches on apposing surface of parallelsubstrates. A user's input contact with the sensor surface is detectablewhen the conductive particles, tubes, wires or polymer elements inapposing patches are forced into contact with each other and with theconductive traces when the input force is applied. The more force, themore conductive elements make contact allowing the electrons to travelfrom one conductive trace through the contacting FSR CNT patches to aperpendicular conductive trace. Higher force also increases the contactarea between the substrates that also increases conductance betweenconductive elements in contact on each substrate.

A small area of contact between apposing patches and their conductivetraces is made when an actuator (the device that touched the sensorsurface) such as a human finger makes initial contact with the sensor.As force is increased the area of contact increases bringing moreparticles into play and thus increasing the conductivity of the device.

A suitable force sensing membrane is made using two parallel substrates.A first substrate has rows and columns of conductive traces formed on afirst side of the substrate. Where the column traces intersect the rowtraces, the column traces are interrupted by forming an electricalconnection through the substrate from the first side to the second sideand crossing the row trace and then again forming an electricalconnection from the second side of the substrate to the first side ofthe substrate and connecting with the interrupted column trace.

Alternatively, a dielectric or insulating pad can be printed over therow traces allowing an uninterrupted column trace to be depositedperpendicular to the row traces over the dielectric or insulating padswith a top coat of a suitable conductor such as silver. Parallel to thecolumn traces are short conductor leg traces. On the first side of thesecond substrate are deposited FSR elements such as patches ofconductive material such as CNT. When the substrates are orientedparallel with the first sides in apposition, the patches of theconductive material align over a column trace and a short leg trace suchthat pressure on the membrane causes one or more conductive patches toengage a column trace and a short leg trace forming a force sensitiveresistance circuit.

A trampoline sensor as described below provides a hybrid force sensingmembrane which is secured along its perimeter over on opening sized andshaped to correspond to the size and shape of the force sensingmembrane. A user applying force input to the sensor membrane does notencounter a hard surface beneath the sensor membrane. Instead the sensormembrane operates like a trampoline providing an increased travel when aforce is applied with no hard feel at the end of the sensor travel. Atrampoline sensor may also include hybrid capacitive input sensing asdescribed below.

Force-sensing resistors date back to Eventoff U.S. Pat. Nos. 4,314,227,4,314,228, etc. which disclose two basic FSR configurations, the“ShuntMode and ThruMode.” Both configurations are constructed withvarious formulations of force-sensing-resistor inks. Typically thesolvent based ink is screen printed and cured on any suitable substratefrom glass to PET/Mylar or other compounds to makes a force-sensingresistor element, however any other suitable methods of deposition orprinting may also be used.

These and other features and advantages will become further apparentfrom the detailed description and accompanying figures that follow. Inthe figures and description, numerals indicate the various features ofthe disclosure, like numerals referring to like features throughout boththe drawings and the description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic of a portion of a force sensor array.

FIG. 2 is an exploded block diagram of the elements of a force sensingelement of the force sensor array of FIG. 1.

FIG. 3 is an oriented layout diagram of the elements of FIG. 2.

FIG. 4 is a cross section diagram of the force sensor assembly includingthe force sensing array of FIG. 1 taken along A-A.

FIG. 5 is a schematic circuit diagram of a force sensing assembly.

FIG. 6 is a layout diagram of a portion of a single layer conductivetrace arrangement.

FIG. 7 is a layout diagram of conductive FSR patches for use with theconductive trace arrangement of FIG. 6.

FIG. 8 is a top view of a single force sensor conductive patch and itscorresponding traces.

FIG. 9 is a cross-section view of the force sensor of FIG. 8.

FIG. 10 is a cross-section view of a trampoline force sensor.

FIG. 11 is a cross-section view of an alternate trampoline force sensor.

FIG. 12 is a cross-section view of a capacitive force sensor.

FIG. 13A is a cross-section view of an FSR sensor before pre-load.

FIG. 13B is a cross-section view of an FSR sensor after pre-load.

FIG. 14 is a cross-section view of an FSR sensor with external pre-loadapplied.

FIG. 15A is a side view of a conductive peg and cooperating FSRpackaging.

FIG. 15B is a close-up view of the pre-loaded FSR sensor of FIG. 15Ataken along A-A.

FIG. 16 is a front perspective of the conductive peg and FSR sensor ofFIG. 15B.

FIG. 17 is a schematic diagram of the circuit formed using the apparatusof FIG. 15A.

DETAILED DESCRIPTION OF THE INVENTIONS

Referring now to FIG. 1, force sensing assembly 10 includes force sensorarray 11 which is formed from one or more force sensing resistorassemblies such as FSR assemblies 12, 14, 16 and 18. Each FSR assemblyis oriented between parallel rows of conductor traces on each substratesuch as first traces 19 and second traces 21. FSR performance may beimproved by including a highly conductive pad or patch between thesubstrate and each FSR patch.

A force sensing assembly may be formed using two parallel substratessuch as first substrate 22 and second substrate 23 as illustrated inFIGS. 2, 3 and 4. First substrate 22 has parallel conductive traces 19printed along with a conductive leg such as leg 12A for each FSRassembly such as FSR assembly 12. Second substrate 23 has parallelconductive traces 21 printed along with a conductive leg such as leg 12Bfor each FSR assembly such as FSR assembly 12. When first substrate 22and second substrate 23 are properly aligned with the deposited tracesand patches in apposition, first conductive traces 19 are orientedperpendicular to second perpendicular traces 21. Near each conductiveleg on each substrate, an FSR patch such as patch 24 and patch 25 aredeposited. Insulating elements or pads such as insulator pads 26 aredeposited on either substrate over the conductive traces at the pointswhere the corresponding conductive trace on the other substrate would bein contact when the substrates are aligned in apposition as illustratedin FIGS. 3 and 4. Insulating elements 26 separate the first conductorsfrom the second conductors. Optional, highly conductive patches may bedeposited between each FSR patch and the substrate that supports it. Forexample, highly conductive patches 24B and 25B may be deposited betweenFSR patches 24 and 25 and substrates 22 and 23 respectively.

Controlling the dynamic range, the measured resistance of an FSR circuitas a function of applied force on the sensor, is possible by controllingthe size and texture of the conductive patches or electrodes as well asthe spacing between the electrodes on the sensor substrates as well asthe pre-load holding the substrates in contact without user input force.For example, using the aerosol jet deposition method to form theelectrodes or patches, such as patches 24 and 25 of FIG. 4 or conductors44 and 48 of FIG. 9, a second layer, layer 27, of small dots or dashes27A or other shapes over the base conductor electrode may be applied inan effort to emulate the texture of a thick-film silver and FSRdeposition. A thick-film FSR has a better dynamic range when used inconjunction with a thick-film silver electrode with few small conductivepeaks or spots as opposed to using a “flat” copper trace. Having toomany spots or peaks causes the electrode to behave similar to a smoothflat conductor. In addition, pre-loading or compressing the substratesinto a normal state of contact such as illustrated in FIGS. 13B and 14.This contact state, or pre-load state may form the lower threshold forswitch or sensor closure thus eliminating low contact noise andinconsistencies between sensors. Pre-loading an FSR also reduces thedynamic range of the sensor.

Referring now to FIG. 4, first substrate 22 has first conductive tracessuch as traces 19A and 19B, conductive leg 12A and first FSR patch 24deposited on a first surface such as conductor surface 22A. Secondsubstrate 23 has second conductive traces such as traces 21A and 21B,conductive leg 12B and second FSR patch 25 deposited on a first surfacesuch as conductor surface 23A. Each substrate has a corresponding secondsurface such as second surfaces 22B and 23B respectively. When twoprinted substrates are aligned in parallel, the first surfaces of eachsubstrate are aligned in apposition with the parallel traces on eachsubstrate oriented perpendicular to the conductive traces of theapposing substrate yielding a force sensing assembly such as forcesensing assembly 10 with the second surfaces of each substrate operatingas a contact surface for the application of force to be detected andmeasured.

In use, pressure on the second surfaces 22B or 23B of either first orsecond substrate at or near an FSR assembly such as FSR assembly 12 willcreate a force sensitive circuit such as circuit 30 of FIG. 5 thatextends from first conductive trace 19A to second conductive trace 21Athrough the three resistive elements described below. First resistiveelement 32 is formed by the interaction of a portion of second FSR patch25 with conductive leg 12A. Second resistive element 33 is formed by theinteraction of a portion of first FSR patch 24 with second FSR patch 25.Third resistive element 34 is formed by the interaction of a portion offirst FSR patch 24 with conductive leg 12B. The resistance value of eachresistive element is proportional to the pressure applied to thesubstrate and the location of the pressure.

Referring now to FIGS. 6, 7, 8 and 9, an array of force sensorassemblies may be formed using two parallel substrates, such assubstrates 40 and 41. First substrate 40 has rows and columns ofconductive traces such as row traces 42 and column traces 44 formed onfirst side 40A of the substrate. Where the column traces intersect therow traces, such as intersection point 45, the column traces areinterrupted by forming an electrical connection through the substratefrom first side 40A to second side 40B and crossing the row trace with ajumper trace such as jumper trace 47 and then again forming anelectrical connection such a connection 49 from second side 40B of thesubstrate to first side 40A of the substrate and reconnecting withinterrupted column trace 44.

Electrical connection 49 may be formed using any suitable technique. Auseful technique for forming electrical connection 49 when the majorityof conductors are deposited using printing methods is accomplished byadjusting the viscosity of the conductive liquid being deposited topermit the conductive liquid to flow in and through a hole, such as hole46 formed between first side 40A to second side 40B.

Alternatively, a dielectric or insulating pad can be printed over therow traces allowing an uninterrupted column trace to be depositedperpendicular to the row traces over the dielectric or insulating padswith a top coat of a suitable conductor such as silver. Parallel to thecolumn traces are short conductor leg traces. On the first side of thesecond substrate are deposited FSR elements such as patches ofconductive material such as CNT. When the substrates are orientedparallel with the first sides in apposition, the patches of theconductive material align over a column trace and a short leg trace suchthat pressure on the membrane causes one or more conductive patches toengage a column trace and a short leg trace forming a force sensitiveresistance circuit.

Parallel to the column traces are short conductor leg traces such as legtraces 48. An array of force sensing assemblies such as force sensingassembly 50 is formed with an array of patches such as conductive patch51 are deposited on first side 41A of second substrate 41. Highlyconductive backing patches such as patches 51B may first be deposited onsubstrate 41 and FSR conductive patches such as patch 51 may bedeposited on the highly conductive backing patch to improve FSRperformance. FSR elements or patches such as conductive patch 51 includeconductive material such as CNT or PEDOT. When substrates 40 and 41 areoriented parallel with first sides 40A and 41A in apposition, theconductive patches such as patch 51 align over an interrupted columntrace and a short leg trace as illustrated in FIGS. 8 and 9 to formforce sensing assemblies such as force sensing assembly 50. In use,pressure on the membrane causes one or more conductive patches to engagea column trace and a short leg trace forming a force sensitiveresistance circuit as discussed above.

Alternatively, substrate 41 may not have a plurality of conductive orsemi-conductive patches such as patches 51, instead having a singleflood layer of conductive or semi-conductive material deposited onsubstrate 41 with the conductive area apposing parallel conductorsforming a force sensing assembly.

Force sensing membranes as discussed, and pre-loaded force sensingmembranes may also benefit from a trampoline configuration such asillustrated in FIGS. 10, 11, 13A, 13B and 14. Force sensor 60 is formedwith two parallel substrates such as first and second substrates 61 and62 as discussed above. Each substrate may be planar or may be shaped toform a flexible section such as sections 61A and 62A respectively tooptimize sensor movement along the z-axis. Each substrate containing oneor more FSR elements such as conductive deposits and or traces to form aforce sensing resistor to quantify the location and intensity of forceapplied to the active area of the sensor. Sensor support 63 includesopenings such as opening 64 sized and dimensioned to correspond toactive area 65 of force sensor 60.

Force sensor 60 may be formed with the force sensing elements on eachsubstrate oriented to provide one or more different active areascorresponding to each force sensing element. Multiple openings in sensorsupport 63 are formed with each opening collocated with a force sensingelement

Force sensor 70 is formed with two parallel substrates such as first andsecond substrates 71 and 72 as discussed above. Each substrate is shapedto form a flexible section such as sections 71A and 72A respectively toallow sensor movement along the z-axis. Each substrate containing one ormore FSR elements such as conductive deposits and or traces to form aforce sensing resistor when force is applied to the active area of thesensor.

Referring now to FIG. 12, First conductive layer 78 and secondconductive layer 79 of force sensing resistor 80 may also be used aselements of a capacitive sensor to sense the presence and location of auser's stylus, hand, finger or other conductive apparatus or appendagealong the z-axis. Conductive area 81 is deposited on first conductivelayer 78 and conductive traces 82 are deposited on second conductivelayer 79 to form a force sensing resistor. A voltage applied across theconductive layers creates a capacitive sensor reactive to a conductiveappendage such as finger 83 in sensor space 84.

Referring now to FIGS. 13A and 13B, sensor 90 is a force sensingresistor as described above and includes substrates 91 and 92 withconductive contacts 91A and 92A deposited thereon respectively andoptional highly conductive backing contacts as well. Generally,substrates 91 and 92 are oriented with conductive contacts 91A and 92Ain apposition with some separation 94 between the conductive contacts asshown. Pre-loading of the substrates as illustrated in FIG. 13B bringsconductive contacts 91A and 92A into a pre-determined level of contactwhich is determined by pre-load force 95. In this configuration,pre-load force 95 is controlled by first and second embossed edges 97and 98 respectively.

Alternatively, pre-load force 95 between first substrate 91 and secondsubstrate 92 may be generated by an adhesive layer 99 between thesubstrates, or by drawing a vacuum in space 100, or by installing afixed weight or weights 101 on first substrate 91 to use gravity to urgethe substrates into pre-load position 102. These configurations forachieving FSR pre-load are fixed during manufacture and present littleopportunity to change or adjust the intensity of the pre-load forceduring use.

Referring now to FIG. 14 FSR sensor 110 is pre-loaded using magneticfield 111 between first or upper magnet 113 and any suitably orientedferrous material such as second or lower magnet 114. The size of themagnets and the strength of field 111 permits control of pre-load force116. Magnets 113 and 114 may be fixed magnets for providing a fixedpre-load, alternatively, either or both of the magnets may be electromagnets enabling controllable variation in pre-load force 116. If theelectro-magnet may also be configured to create a repulsive force to seta negative pre-load of offset that must be overcome to engage the FSR.Similarly, either first magnet 113 or second magnet 114 may be replacedby suitable ferrous material to interact with the remaining magnet orelectro-magnet.

In some FSR configurations, the conductive electrodes deposited on thesubstrates may be made magnetic to achieve a pre-load between thesubstrates. Alternatively, the ink used for the FSR conductive patchesmay be made magnetic to create the pre-load.

Pre-loaded FSR sensors may be incorporated into or on merchandisepackaging to assist in minimizing theft. Referring now to FIGS. 15A, 15Band 16, pre-loaded FSR sensor 120 is incorporated into merchandisepackaging 121. Merchandise may be displayed and supported by pegs, rods,hooks or other devices such as peg 122 which is supported on amerchandise display rack such as rack 123. Peg 122 includes one or moreconductive elements such as electrodes 124 and 126 which are connectedto any suitable merchandise security system such as system 125.Merchandise packaging 121 is cut and shaped to form a tab such as tab127 which functions as a leaf spring which provides elastic support forpackaging 121 and any attached merchandise. Tab 127 is configured toenable the weight of packaging 121 and the attached merchandise topreload the FSR. Tab 127 has a first side 127A and a second side 127B.Second side 127B serves as a substrate for conductive FSR patch 128which may be formed and deposited as discussed above.

When merchandise packaging is displayed as illustrated in FIG. 15A,circuit 129 of FIG. 17 formed by FSR patch 128 and electrodes 124 and126 is pre-loaded by the spring action of tab 127. The pre-load enablescircuit 129 to react to a change in the resistance of the circuit causedby movement of packaging 121 which may or may not be caused by alegitimate purchaser.

Thus, while the preferred embodiments of the devices and methods havebeen described in reference to the environment in which they weredeveloped, they are merely illustrative of the principles of theinventions. Other embodiments and configurations may be devised withoutdeparting from the spirit of the inventions and the scope of theappended claims.

I claim:
 1. A force sensing assembly comprising: a generally planarfirst substrate having a conductor surface and an opposing touchsurface; a plurality of parallel conductive traces on the conductivesurface of the first substrate; an array of conductive patches orientedbetween adjacent parallel conductive traces and each patch iselectrically connected to the conductive traces on the conductivesurface of the first substrate; a generally planar second substratehaving a conductor surface and an opposing touch surface; a plurality ofparallel conductive traces on the conductive surface of the secondsubstrate; an array of conductive patches oriented between adjacentparallel conductive traces and each patch is electrically connected tothe conductive traces on the conductive surface of the second substrate;wherein the first substrate and the second substrate are orientedparallel to each other with the conductive surfaces of each substrate inapposition and the plurality of parallel conductive traces on the firstsubstrate oriented perpendicular to the plurality of conductive traceson the second substrate; a plurality of insulating pads secured on theconductive traces on the first substrate where the perpendicular tracesof the second substrate intersect the traces of the first substrate; andmeans for pre-loading the first and second substrate to create apre-load force between the first and second substrate.
 2. The forcesensing assembly of claim 1 wherein each conductive patch of the arraysof conductive patches are formed of at least two layers of conductivematerial.
 3. The force sensing assembly of claim 2 wherein the arrays ofconductive patches are formed of conductive material selected from thegroup comprising: carbon allotropes, conductive polymers or metaloxides.
 4. The force sensing assembly of claim 2 wherein the arrays ofconductive patches are formed of graphene.
 5. The force sensing assemblyof claim 2 wherein the arrays of conductive patches are formed ofPoly(3,4-ethylenedioxythiophene.
 6. The force sensing assembly of claim2 wherein the arrays of conductive patches are formed of indium tinoxide.
 7. The force sensing assembly of claim 1 wherein the means forpre-loading the substrates is adhesive applied between the first andsecond substrate.
 8. The force sensing assembly of claim 1 wherein themeans for pre-loading the substrates is a vacuum drawn between the firstand second substrate.
 9. The force sensing assembly of claim 1 whereinthe means for pre-loading the substrates is an embossed edge formed onthe first substrate and a second embossed edge formed on the secondsubstrate.
 10. The force sensing assembly of claim 1 wherein the meansfor pre-loading the substrates is a first magnet secured on the firstsubstrate and a second magnet secured on the second substrate.
 11. Theforce sensing assembly of claim 10 wherein the first magnet is anelectro-magnet.
 12. The force sensing assembly of claim 1 wherein one ofthe at least two layers of each conductive patch is highly conductiveand oriented between the other of the at least two layers of theconductive patch and the substrate.
 13. An FSR sensor assemblycomprising: two generally planar, flexible substrates oriented parallelto each other; a conductive patch and conductors deposited between thetwo substrates forming an FSR force sensor in an active area of thesubstrates; means for creating a pre-load force between the conductivepatch and the conductors of the FSR sensor; a support with a hole therethru, the hole sized to correspond to the active area of the substrates;and wherein the two substrates are secured to the support with theactive area collocated on the hole.
 14. The hybrid force sensor of claim13 wherein the arrays of conductive patches are formed of at least twolayers of conductive material.
 15. The force sensing assembly of claim13 wherein the means for pre-loading the substrates is adhesive appliedbetween the first and second substrate.
 16. The force sensing assemblyof claim 13 wherein the means for pre-loading the substrates is a vacuumdrawn between the first and second substrate.
 17. The force sensingassembly of claim 13 wherein the means for pre-loading the substrates isan embossed edge formed on the first substrate and a second embossededge formed on the second substrate.
 18. The force sensing assembly ofclaim 13 wherein the means for pre-loading the substrates is a firstmagnet secured on the first substrate and a second magnet secured on thesecond substrate.
 19. The force sensing assembly of claim 18 wherein thefirst magnet is an electro-magnet.